Face-To-Face Transducer Frequency 400 kHz / 1 MHz

Single Process Cleaning of Substrates and Semiconductor Wafer with a size of up to 300 mm

Hermetically encapsulated transducer made of PFA, to be mounted over the rotating substrate. In order to transmit the Megasonic energy there has to be always a liquid layer between the substrate surface and the active transducer bottom side when in operation.

The Megasonic energy is transmitted homogeneously with a uniform sound wave over the active transducer surface, of
app. 150 x 25 mm, right-angled on the substrate.